Hall Sensor

Divided By Scale

Allegro provides a unique solution for current sensing by developing proprietary packaging using flip chip technology. This technology can generate excellent magnetic coupling effect in coreless packaging design and provide electrical isolation up to 4800 VRMS.

Divided By Scale

Allegro provides a unique solution for current sensing by developing proprietary packaging using flip chip technology. This technology can generate excellent magnetic coupling effect in coreless packaging design and provide electrical isolation up to 4800 VRMS.

Divided By Scale

Allegro provides a unique solution for current sensing by developing proprietary packaging using flip chip technology. This technology can generate excellent magnetic coupling effect in coreless packaging design and provide electrical isolation up to 4800 VRMS.

Divided By Scale

Allegro provides a unique solution for current sensing by developing proprietary packaging using flip chip technology. This technology can generate excellent magnetic coupling effect in coreless packaging design and provide electrical isolation up to 4800 VRMS.

Divided By Scale

Allegro provides a unique solution for current sensing by developing proprietary packaging using flip chip technology. This technology can generate excellent magnetic coupling effect in coreless packaging design and provide electrical isolation up to 4800 VRMS.

Divided By Scale

Allegro provides a unique solution for current sensing by developing proprietary packaging using flip chip technology. This technology can generate excellent magnetic coupling effect in coreless packaging design and provide electrical isolation up to 4800 VRMS.

Divided By Scale

Allegro provides a unique solution for current sensing by developing proprietary packaging using flip chip technology. This technology can generate excellent magnetic coupling effect in coreless packaging design and provide electrical isolation up to 4800 VRMS.

Divided By Scale

Allegro provides a unique solution for current sensing by developing proprietary packaging using flip chip technology. This technology can generate excellent magnetic coupling effect in coreless packaging design and provide electrical isolation up to 4800 VRMS.

Divided By Scale

Allegro provides a unique solution for current sensing by developing proprietary packaging using flip chip technology. This technology can generate excellent magnetic coupling effect in coreless packaging design and provide electrical isolation up to 4800 VRMS.